“In Figure 2 there’s a 10-amp pulse train, 20 volts high, nine nanoseconds wide, and the on-time is about 400 picoseconds, the off-time is about 300 picoseconds.
#3 chip driver series
Through Figures 2 and 3, Lidow showed how a series of tests confirmed the new device’s validity for high-speed applications. So you can replace both ultrasonic sensors and camera chips with a single short-range.” The EPC21601 is specifically designed for high speed, short pulse operation while minimizing the number of external parts required. That’s their limitation, which has to do with operating frequency. He added, “Ultrasonic sensors cannot detect less than 30 centimeters. “This product family will enable faster adoption of ToF in a wider range of end-user applications,” said Lidow. The EPC21601 is offered in a chip-scale package (CSP) and is easier to assemble, saves PCB space, and increases overall efficiency.
#3 chip driver driver
The integration of the driver and power FET reduces the common source inductance to just a few Pico Henry, thus improving pulse rise and fall times, and therefore resolution for objects that are very close,” said Lidow. And so, even if you go down to 10 or 20 Pico Henry, it’s a big deal. And if you have 50 Pico Henry of inductance, your speed is halved. “One of the things to consider when using two separate chips instead of one is that two chips will have about 50 Pico Henry of inductance between the driver and the power FET. It is a 40-volt, 10-amp FET device intended to drive a VCSEL with a 3.3-volt logic-level input.
#3 chip driver plus
The EPC21601 is a single-chip plus eGaN® FET driver using EPC’s proprietary GaN IC technology in a chip-scale BGA form factor that measures 1.5 mm x 1.0 mm. The on and off times are 410 ps and 320 ps, respectively. The EPC21601 is a laser driver that is controlled using 3.3 V logic at high frequencies up to 200 MHz to modulate laser drive currents up to 10 A. So indirect time-of-flight tends to be an excellent mechanism for doing near applications, and it’s not an effective mechanism for distant objects.” And if you want to go farther away, the power requirements get bigger because you’re using a non-directional optical pulse. He added, “If you’re looking at something a few feet away, you only need about 1 to 10 amps of current, employing vertical-cavity surface-emitting lasers (VCSELs). And they measure the phase difference of that integrated pulse stream, which tells you how far away the object is,” said Lidow. And they do that with a pulse stream on the order of 100 megahertz. And so what people do for this indirect time-of-flight to measure short distances is to use a lot of light power. So, basically, you look at the output pulse, and you subtract that from the return pulse. “Light travels one meter every three nanoseconds, so if you have a pulse that’s one nanosecond wide, you can’t really measure objects that are closer than about one meter, unless what you’re looking at is the phase difference between the output and the input. When you have to get close to an object in these applications, there is an issue with the laser signal’s pulse width. “The ToF technology is pretty simple, it essentially measures the round trip time, “said Lidow. Pulsed LiDAR technology is used for long distances with direct measurement of how long a photon has traveled the round trip distance, and this is called Time of Flight (ToF). “GaN technology supports these two characteristics making it ideal for LiDAR,” commented Lidow. Short pulse widths provide higher resolution, and a high pulse current enables LiDAR systems to reach high distances.
#3 chip driver full
LiDAR technology offers accuracy, wide-area coverage, and full digital support for data collection.įETs with GaN technology prove suitable as a driver element for laser switching, driving high-current and extremely short pulses. LiDAR is a technique for measuring the distance between objects using pulsed lasers, and through the acquired information, a 3D image can be obtained. The EPC21601 laser driver integrates a 40 V, 10 A FET with an integrated gate driver and 3.3 logic level input into a single chip. In an interview with EE Times, Alex Lidow, CEO at EPC, highlighted how introducing the eToF Laser Driver family’s for LiDAR system design at a low cost competes with the Mosfet when it comes to LiDAR applications. The new gallium nitride (GaN) family aims to deliver time-of-flight (ToF) applications for autonomous cars and 3D sensing across the consumer and industrial sectors.
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